
Thermal Pad
It can be used between power devices and heat dissipation aluminum or machine shell. It has good insulation and withstand voltage characteristics and thermal stability. It is safe and reliable to use.
DQL-TP-L300DQL-TP-H600 DQL-TP-H800 DQL-TP-L350PTDQL-TP-H800PTDQL-TIP-150DQL-TIP-350
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DQL-TP-L300Low HardnessHigh-resilienceDQL-TP-L300 it has high thermal conductivity and low interface thermal resistance under relatively low pressure. It can be used between power devices and heat dissipation aluminum or machine shell. It has good insulation and withstand voltage characteristics and thermal stability. It is safe and reliable to use.
TC3.0W
HS40
BV>6
TI0.61
SHAPEPad
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DQL-TP-H600Low Oil BleedingLow HardnessDQL-TP-H600 it has high thermal conductivity and low interface thermal resistance under relatively low pressure. It can be used between power devices and heat dissipation aluminum or machine shell. It has good insulation and withstand voltage characteristics and thermal stability. It is safe and reliable to use.
TC6.0W
HS55/45
BV>6
TI0.26
SHAPEPad
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DQL-TP-H800Low Oil BleedingLow HardnessDQL-TP-H800 it has high thermal conductivity and low interface thermal resistance under relatively low pressure. It can be used between power devices and heat dissipation aluminum or machine shell. It has good insulation and withstand voltage characteristics and thermal stability. It is safe and reliable to use.
TC8.0W
HS70
BV>6
TI0.20
SHAPEPad
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DQL-TP-L350PTExtra SoftDQL-TP-L350PT it has ultra-high thermal conductivity, good flexibility and resilience, which can reduce the structural stress and protect the chip.
TC3.5W
HS5
BV>6
TI0.47
SHAPEPad
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DQL-TP-H800PTExtra SoftDQL-TP-H800PT it has ultra-high thermal conductivity, good flexibility and resilience, which can reduce the structural stress and protect the chip.
TC8.0W
HS5
BV>6
TI0.21
SHAPEPad
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DQL-TIP-150High Breakdown VoltageDQL-TIP-150 is a kind of thermal conductive insulating sheet with glass fiber reinforced substrate. It has high thermal conductivity and excellent insulation performance. It is mainly used between heating semiconductor devices and heat dissipation substrate, playing the role of heat conduction and insulation.
TC1.5W
HS90
BV5.5
TI0.92
SHAPEPad
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DQL-TIP-350High Breakdown VoltageDQL-TIP-350 is a kind of thermal conductive insulating sheet with glass fiber reinforced substrate. It has high thermal conductivity and excellent insulation performance. It is mainly used between heating semiconductor devices and heat dissipation substrate, playing the role of heat conduction and insulation.
TC3.5
HS80
BV5.5
TI0.25
SHAPEPad