DQL-TP-L300 it has high thermal conductivity and low interface thermal resistance under relatively low pressure. It can be used between power devices and heat dissipation aluminum or machine shell. It has good insulation and withstand voltage characteristics and thermal stability. It is safe and reliable to use.

DQL-TP-H600 it has high thermal conductivity and low interface thermal resistance under relatively low pressure. It can be used between power devices and heat dissipation aluminum or machine shell. It has good insulation and withstand voltage characteristics and thermal stability. It is safe and reliable to use.

DQL-TP-H800 it has high thermal conductivity and low interface thermal resistance under relatively low pressure. It can be used between power devices and heat dissipation aluminum or machine shell. It has good insulation and withstand voltage characteristics and thermal stability. It is safe and reliable to use.

DQL-TP-L350PT it has ultra-high thermal conductivity, good flexibility and resilience, which can reduce the structural stress and protect the chip.

DQL-TP-H800PT it has ultra-high thermal conductivity, good flexibility and resilience, which can reduce the structural stress and protect the chip.

DQL-TIP-150 is a kind of thermal conductive insulating sheet with glass fiber reinforced substrate. It has high thermal conductivity and excellent insulation performance. It is mainly used between heating semiconductor devices and heat dissipation substrate, playing the role of heat conduction and insulation.

DQL-TIP-350 is a kind of thermal conductive insulating sheet with glass fiber reinforced substrate. It has high thermal conductivity and excellent insulation performance. It is mainly used between heating semiconductor devices and heat dissipation substrate, playing the role of heat conduction and insulation.