DQL-TG-H700S
DQL-TG-H700S is a paste like gap filling thermal conductive material between liquid and solid. It is shaped according to the structure shape and can be used in a very wide temperature range.
Features and advantages

● High TC,Low TI

● High electrical insulation

● High compressibility

 

Product parameters
Application field
  •  Phone
  • Computer
  • UAV
  • Communication
  • The server
  • Automotive electronics